Check the documentation for your soldering station, if your soldering station doesn’t have any documentation you can go with the melting point of the solder itself plus some overhead.

But as illustrated below, it can get a little complicated, if you’re doing a lot of soldering with the same solder you’ll experiment and figure out what’s good for you

Ideally you want to use the lowest temperature you can get away with, using too much temperature can potentially shorten the lifespan of your soldering tips, and potentially damage the printed circuit board.

Get a testing board, any old board will do, and do some soldering and desoldering at different temperatures.

https://kb.hakkousa.com/KnowledgebaseArticle10297.aspx

lets look at the melting points of common solders:

• Tin/Lead (Sn63/Pb37) - 183°C
• SAC 305 (Sn/Ag3.0/Cu0.5) - 220°C
• SN100 (Sn) - 232°C

Now let’s add the 50°C we need for making a good soldering connection:

• Tin/Lead: 183°C + 50°C = 233°C
• SAC 305: 220°C + 50°C = 270°C
• SN100: 232°C + 50°C = 282°C

We now need to consider the type of soldering station we are using…Soldering Station which has very good performance, we should add approximately 100°C as the heat reserve for quick thermal recovery.  The resulting temperature settings are:

• Tin/Lead: 233°C + 100°C = 333°C
• SAC 305: 270°C + 100°C = 370°C
• SN100:  282°C + 100°C = 382°C